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  TE Connectivity

Contact:

Product Communications:
Patrick Hibbs, Global Strategic
Marketing and ESD Business Manager
patrick.hibbs@te.com
214.725.5701
Media Communications
Hope-Sutton Salvador
Global Manager Marketing Communications
hope-sutton.salvador@te.com
(650) 361-2160



TE Circuit Protection Introduces Industry’s Lowest Capacitance Silicon
ESD Devices for High-Data-Rate Applications

New SESD device family provides lowest insertion loss for highest-speed interfaces
(e.g., USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt technology)

MENLO PARK, Calif. – February 9, 2012 –TE Circuit Protection, a business unit of TE Connectivity, announces a family of eight new single- and multi-channel silicon ESD (SESD) protection devices offering the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20kV air and contact discharge) and smallest size (multi-channel: smallest flow-through form-factor and 0.31mm height) packages available on the market.

The devices’ ultra-low-capacitance results in the industry’s lowest insertion loss, which is essential for maintaining signal integrity in ultra-high-speed applications. The devices help protect against damage caused by electrostatic discharge (ESD), surge and cable discharge events. The multi-channel devices also feature a flow-through design package that allows for matched impedance of PCB trace routing, which is essential for maintaining high-speed signal integrity. The ultra-low-capacitance, small size and high ESD kV rating of the SESD devices are well-suited for smart phones, HDTVs and similar consumer, auto and other markets’ products using today’s – and tomorrow’s – highest-speed interfaces such as USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt.

The single- and multi-channel SESD devices also feature an industry-leading 20kV contact and air discharge rating, exceeding IEC61000-4-2’s 8kV industry standard. In the event of a high voltage ESD strike, this high kV rating helps minimize the risk of the ESD device failing short and permanently disabling the port, or open, exposing the downstream chipset to damage caused by another ESD strike. This capability helps reduce customer complaints and warranty repair costs.

SESD600

“ESD protection devices add capacitance on data lines, which in turn can cause signal integrity issues that hamper a product’s performance and interoperability. Today’s high-speed ports need the lowest-capacitance ESD devices available to provide the highest degree of protection while having minimal effect on signal transmission,” said Patrick Hibbs, Global Strategic Marketing and ESD Business Manager for TE Circuit Protection. “Our new SESD devices offer capacitance that is up to 92% lower than competing ‘ultra-low-capacitance’ solutions. This means our SESD devices are ready for Thunderbolt applications today. And even though the 4K ultra-high-definition (UHD) and quad high-definition (QHD) TV markets are still emerging, our SESD devices are ready for these applications as well.”

Consumer electronics are constantly shrinking and TE Circuit Protection’s SESD devices offer size advantages in the ongoing trend for miniaturization. The single-channel devices are available in 0201-sized XDFN small footprint (0.6mm x 0.3mm x 0.31mm) and 0402-sized XDFN (1.0mm x 0.6mm x 0.38mm) packages. The multi-channel SESD arrays (two-, four- and six-channel options) feature a package height as low as 0.31mm– resulting in up to a 50% lower profile than comparable devices. The SESD devices’ lower profile allows for placement closer to the edge of the PCB, or in-between boards and connectors, facilitating design flexibility.

Additionally, one miniature four-channel SESD array can be used in a smaller board area than four 0201 devices, resulting in board space, assembly cost and device cost savings. As the smallest 4- and 6-channel flow-through arrays on the market, these devices also ease routing when used with applications employing miniature-size connectors, such as HDMI Type-D, mini DisplayPort, Thunderbolt and USB 3.0 Micro-B.

Product Family Description:

  • SESD0201X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0201 package
  • SESD0402X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0402 package
  • SESD0201X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0201 package
  • SESD0402X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0402 package
  • SESD0402Q2UG-0020-090: 2-channel, uni-di, 0.20pF cap., 20kV rating, 0402 3L package
  • SESD0802Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package
  • SESD1004Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, standard array package
  • SESD1103Q6UG-0020-090: 6-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package

     Price: Unit pricing starting at $0.16 for 10,000 unit quantities

     Availability: Now

     Delivery: 12 weeks ARO

ABOUT TE Connectivity

TE Connectivity is a global, $14 billion company that designs and manufactures nearly 500,000 products that connect and protect the flow of power and data inside the products that touch every aspect of our lives. Our nearly 100,000 employees partner with customers in virtually every industry—from consumer electronics, energy and healthcare, to automotive, aerospace and communication networks—enabling smarter, faster, better technologies to connect products to possibilities.

All trademarks are the property of their respective owners without referring to any trademarks specifically.

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