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Coilcraft’s New 0402-sized Ceramic Chip Inductors Provide Q Factors up to 162 at 2.4 GHz

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New 0402DC Series ceramic wirewound chip inductors offer the industry’s highest Q factors in an 0402 (1005) size – up to 162 at 2.4 GHz – for super low loss in high frequency circuits.

It is offered in 26 standard inductance values ranging from 3.0 to 120 nH. An additional 73 values are available upon request, including 0.1 nH increments from 2.8 nH to 10 nH. Most values are available with 2% tolerance.  The 0402DC Series features a wirewound construction for extremely high self resonance – up to 16 GHz. It also offers DCR as low as 37 mΩ, significantly lower than other 0402-sized chip inductors.  0402DC Series chip inductors are ideal for impedance matching circuits for low band (700 – 960MHz) and high band (1710 – 2700MHz) antennas. Its 0402-sized package is perfect for smartphones and tablets.  0402DC Series inductors feature RoHS compliant, matte tin over nickel over silver-platinum-glass frit terminations and offer a maximum reflow temperature of 260°C.  http://bit.ly/2n1Rvqy

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Leading Global Distributor Features New Articles From TechWire/ClariTek Content Team

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Three FOUR New Technical Articles of Interest to Electronics Industry Engineers Now in Digi-Key Article Library

802.11x Modules, Dev Kits Can Help Simplify IoT Wireless Design Efforts:  http://bit.ly/2r92YZR

Creating the Ultimate Embedded Software Workbench:  http://bit.ly/2mHWfRY

Generating a High DC Output Voltage from a Low Input Supply:  http://bit.ly/2mTfV5m

How to Easily Add Multiple Wireless Technologies to an IoT Design:  http://bit.ly/2rdeaos

 

 

 

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Comparing Low Power Wireless Technologies

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Digi-Key’s Three Part Series Now Available

The multitude of short-range wireless technologies provides engineers with optimized solutions for their applications but makes careful selection paramount.

Part 1 of this three-part series details the major low-power wireless options available to designers. Part 2 considers the design fundamentals of each technology such as chip availability, protocol stacks, application software, design tools, antenna requirements, and power consumption/battery life. Part 3 of the series considers current and future developments designed to meet the challenges of the IoT for each technology. It also includes an introduction to some newer interfaces and protocols, such as Wi-Fi HaLow and Thread.

Read Part 1 Here                         Read Part 2 Here                         Read Part 3 Here

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Samtec Introduces 14 Gbps FireFly™ FMC Development Kit

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Kits Provide Easy Connection Between FPGAs and Fiber Optics

The 14 Gbps FireFly™ FMC Module provides up to 140 Gbps full-duplex bandwidth over 10 channels from an FPGA to an industry-standard multi-mode fiber optic cable. Samtec’s 14 Gbps FireFly™ FMC Development Kit supports Data Center, High Performance Computing and FPGA-to-FPGA protocols including Ethernet, InfiniBand™, Fibre Channel and Aurora. http://bit.ly/2vCZkcx

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D3 Semiconductor Superjunction +FETs™ Push Performance Envelope

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D3 Semiconductor, a company bringing together affiliated semiconductor companies and top-talent experts, announces its inaugural entry into the power semiconductor market with the launch of its +FET™ line of 650V-rated superjunction MOSFETs. +FET MOSFETs enable high-efficiency solutions for a range of hard-switched applications, including PFC boost and inverters used in telecom, enterprise computing, UPS and solar.  http://bit.ly/2mPATUM

 

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